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Connectivity / AiP Module

Connectivity Module

Near-field communication modules enable wireless internet and wireless connection between devices.
Mainly implemented in the 2.4GHz, 5GHz and 6GHz frequency bands, they are equipped with small and thin parts through small form factor packaging technology to provide high-density small form factor module solutions.

Applications
Smartphone, Tablet, Laptop, Home Appliances
General Features
IEEE 802.11 a/b/g/n/ac/ax Standard Compliant
Simulation & Analysis

Design optimized to achieve
high-performance
low-power capabilities

Discrete (CoB) Module 40%

Application of high-density
small form factor
packaging technology

Advance adoption of
new standard technology
to provide high-speed
wireless communication

Proven production
capacity with over 20 years
of R&D in WiFi and history of
mass production of
cutting-edge products

Strategic partnership
with IC companies

Stable SCM achieved
through internalizing
components supply

Line-up

Categories 5 6 6E 7
CE / IT

Broadcom MP

  • 11ac 2x2 RSDB / PCIe
  • BT5.0 / UART

Broadcom MP

  • 11ax 2x2 RSDB / PCIe
  • BT5.0 / UART

Broadcom MP

  • 11ax 2x2 RSDB / PCIe
  • BT5.1 2x2 / UART

Broadcom Plan

  • 11be 2x2 RSDB / PCIe
  • BT5.3 2x2 / UART, Thread

Synaptics Dev

  • 11ax 2x2 / PCIe
  • BT5.3 / UART

Synaptics MP

  • 11ax 2x2 / PCIe
  • BT5.3 / UART

Synaptics Dev

  • 11ax 1x1 / USB / SDIO
  • BT5.3 / UART
  • Thread / 802.15.4 (Zigbee)

Synaptics Plan

  • 11ax 2x2 RSDB / PCIe
    / USB2.0
  • BT5.3 / UART
  • Thread / 802.15.4 (Zigbee)

Qualcomm MP

  • 11ac, 1x1
  • BT4.0

Qualcomm MP

  • 11ax 2x2 / PCIe
  • BT5.1 / UART / M.2 1216

Qualcomm Plan

  • 11ax 2x2 / PCIe
  • BT5.1 / UART / M.2 2230

Qualcomm Dev

  • 11be 2x2 RSDB / PCIe
  • BT5.4 2x2 / UART
Automotive

Infineon Dev

  • Auto Grade 3
  • 11ac, 2x2 / PCIe / SDIO
    / RSDB
  • BT5.1 / UART

Infineon Plan

  • Auto Grade 3
  • 11ax RSDB. 3Antenna / PCIe
  • BR5.4 / Dual BT / UART

Infineon Dev

  • Auto Grade 3
  • 11ax 2x2 PCIe / SDIO
  • BT5.3 / UART

Infineon Plan

  • Auto Grade 3
  • 11be 2x2 PCIe / RSDB
  • BT6.0 / UART

Infineon Plan

  • Auto Grade 3
  • 11ac, 1x1 / PCIe / SDIO
  • BT5.0 / UART

Infineon MP

  • Auto Grade 3
  • 11ac, 1x1 / PCIe / SDIO

AiP (Antenna in Package)
Module

MmWave refers to the band of frequencies between 24GHz and 100GHz. MmWave allows broadband transmission and has various applications including satellite communications, mobile communications, radio navigation, earth exploration, and radio astronomy.
Hanwha NxMD provides a total solution for 5G mmWave modules, from the design of 5G mmWave antenna to the production and test of antenna modules (AiP: Antenna in Package).

Design Optimization for high performance
capabilities achieved with antenna design,
simulation and analysis technology

Module packaging and test conducted
with the designed antenna

5G RAN PAAM (Phased Array Antenna Module)

* Applicable to RU (Radio Unit),
CPE (Customer Premises Equipment) and Repeater

  • Dual Polarization Array Antenna
  • RF Signal Path
    Power Divider
    Digital Interface Path
    DC Power Path
    RF & Power Component
  • Heat Sink

AiP for Smartphones

Conformal Coating Layer
(Sputter)

Compartment Shield Wall
(Paste Fill)

Electric Component
(IC, MLCC, etc)

Epoxy Mold Compound
(Encapsulation)

Antenna Embedded
Substrate