SiP(System in Package) is a heterogeneous integration packaging technology that enables various functionalities through its outstanding thermal performance and a small form factor. Based on state-of-the-art technologies like SMT, Double Side Mold, Grinding, Laser Technology, Sputtering and Laser Cut, Hanwha NxMD manufactures SiP products that meet the clients’ needs.
We provide solutions optimized for various industries and devices
by combining a wide variety of cutting-edge SiP packaging technologies.
IoT
Augmented Reality
Energy
Computer Networking